WaferSense™ Auto Gapping System 200 mm (AGS200) Wireless Gap Measurement

The new WaferSense AGS200 enables 200 mm fabs to benefit from improved uniformity and yield already enjoyed by 300 mm fabs with the AGS300 wireless gap measurement system.

WaferSenseTM AGS200 measures gaps that are critical to the outcome of semiconductor processes such as thin-film deposition, sputtering and etch. It uses a patent pending capacitive sensing technology to measure the distance to a conductive electrode, such as a shower head, to return real time gap measurements that display on your laptop or PC in numerical and graphical form. Since AGS is wireless and wafer-like, it can be handled automatically to speed equipment setup and maintenance.

Features

• Measures gaps at three points. Whether you need to set a gap that is perfectly level or slightly tilted, the three AGS sensors each report separate readings in numerical and graphical form to achieve exactly what you need.
• 200 mm wafer-like form factor.
• Measures gaps with ±25 micron accuracy within 4 hours of field offset calibration.
• Gap resolution ± 5 microns.
• Gapping wafer can be used in temperatures from 20°C to 80°C.
• Wireless technology means WaferSense AGS has no wires that can break after repeated use and AGS will never be misaligned by strained wires.
• GapView™ application software displays numerical and graphical information. Each graphic is color-coded to make it easier to see when the gap is above, below or within the user-defined target gap range.
• GapView lets you log time-stamped measurements to a CSV file for documentation and/or analysis.