WaferSense® Auto Leveling Sensor Keeps Equipment Straight During Wafer Fabrication
Process failures and tool reconfigurations can misalign semiconductor equipment, taking a considerable toll on your productivity. Verifying and realigning equipment can take several hours, causing equipment downtime and loss of revenue. Unlike traditional wired or manual methods, CyberOptics’ WaferSense Auto Leveling System (ALS2) doesn't require equipment disassembly or disruptions to vacuum chambers, so you can reduce calibration time by 80% or more.
Shaped like a wafer, this wireless precision instrument easily captures the inclination of previously out-of-reach semiconductor process equipment. More accurate and less time-consuming than visual inspection, the WaferSense ALS2 reduces setup time and preventative maintenance downtime by promptly delivering reliable, real-time measurements.
Engineers can easily take level measurements using the ALS’ LevelView's real-time "bubble" graphic feedback. Levels can be set to any reference plane within the sensor's operating range (± 4 degrees from absolute). Users can even define Go/No Go regions and log data and notes for future reference.
Because sensors output real-time data, fab engineers don't have to rely upon eyeballing or estimation. WaferSense ALS2 data delivers consistent results to optimize their equipment's setup to limit scrap, improve uptime, and harness better yields.
Here’s how the WaferSense ALS can optimize your wafer fabrication process:
Photolithography: level and set co-planarity of load ports, robots, end effectors, spin cups, pedestals, and lift pins in coater developer track tools.
Etch: level and set co-planarity of load ports, robots and end effectors, as well as leveling the wafer electrode and lift pins.
CMP: leveling and setting co-planarity of load ports, robots, end effectors as well as platen leveling.
Diffusion: level and set co-planarity of load ports, robots and boats in vertical furnaces. ALS conveniently and accurately sets perpendicularity of tall diffusion boats
Thin Films: leveling and setting co-planarity of load ports, robots, end effectors, aligners and stockers, as well as leveling the wafer pedestals and lift pins.
Implant: level and set co-planarity of load ports, robots, end effectors and for leveling Implant Disks.
Metalization: level and set co-planarity of load ports, robots and end effectors as well as controlling the inclination of the wafer during plating tool setup.
Metrology: level and set co-planarity of load ports, robots, end effectors and inspection tool stages.
Fab Automation:level and set co-planarity of load ports, robots, end effectors, aligners, FOUP stockers, as well as FOUP transport system checks and setups.
For more information on the WaferSense ALS, visit http://www.cyberopticssemi.com/products/wafersense/als2 or contact CyberOptics at CSsupport@cyberoptics.com or 800.366.9131